MOU Signing Ceremony between the Faculty of Engineering at Burapha University and RL Digital Co., Ltd.

MOU Signing Ceremony between the Faculty of Engineering at Burapha University and RL Digital Co., Ltd.

The Academic Memorandum of Understanding (MOU) with RL Digital Co., Ltd. stems from a critical need to cultivate a highly skilled workforce specialised in Embedded Systems, the Artificial Intelligence of Things (AIoT), and digital platforms.

The profound significance of this project lies in addressing the exact demands of modern industries within fields such as Smart Electronics, IoT Cybersecurity, and Edge AI. By driving the development of intelligent electronic prototypes, this initiative actively supports targeted sectors including Smart City, Industry 4.0, Electric Vehicles (EVs), and clean energy—all of which are pivotal technologies propelling the nation forward under the “Thailand 4.0” policy.

Project Coordinator:Asst. Prof. Dr Nayot Kurukitkoson (Dean of the Faculty of Engineering)

Objectives:

  • To promote academic advancement, cutting-edge research, and innovation in the fields of Embedded Systems, AIoT, and digital platforms.
  • To cultivate a highly skilled workforce equipped with comprehensive expertise in both hardware and software, effectively answering the demands of modern industrial sectors.
  • To develop intelligent electronic prototypes that support targeted future industries, including Smart City, Industry 4.0, Electric Vehicles, and clean energy.

Program Activities:

On April 21, 2026, the Faculty of Engineering at Burapha University, led by Dean Asst. Prof. Dr. Nayot Kurukitkoson, officially signed an Academic Memorandum of Understanding (MOU) with RL Digital Co., Ltd., represented by its President, Mr. Bill Chen.

This strategic partnership is designed to accelerate academic and research innovations in Embedded Systems, AIoT, and digital platforms. It places a strong emphasis on developing a workforce highly proficient in both hardware and software to meet the needs of the modern industrial landscape seamlessly.

Under this agreement, both parties will collaborate on vital initiatives, including modernising curricula, organising upskilling/Reskilling/New-skill training programs, and jointly supporting R&D in Smart Electronics, IoT Cybersecurity, Edge AI, and digital platforms. The collaboration also focuses on developing smart electronic prototypes for targeted industries such as Smart City, Industry 4.0, EVs, and clean energy.

Furthermore, Burapha University plays a foundational role by providing robust infrastructure, advanced laboratory facilities, and joint curriculum development. This synergy creates a dynamic innovation ecosystem that bridges the academic, governmental, and industrial sectors.

Expected Outcomes (Impacts):

  • Strategic Industry-Academia Synergy: Forged a powerful academic and research partnership with RL Digital Co., Ltd., a recognised leader in embedded systems and AIoT technologies.
  • Targeted Workforce Development: The co-creation of curricula and specialized Up-skill/Re-skill/New-skill training effectively responds to the modern industry’s need for expertise in Smart Electronics, IoT Cybersecurity, Edge AI, and digital platforms. This ensures students and professionals possess highly sought-after, future-proof skills.
  • Prototyping for National Growth: Actively drives the development of intelligent electronic prototypes tailored for targeted industries (Smart City, Industry 4.0, EVs, and clean energy), playing a crucial role in realising the “Thailand 4.0” national agenda.
  • Robust Innovation Ecosystem: Successfully established a collaborative network linking education, government, and industry. Joint R&D efforts between university researchers and corporate engineers translate directly into high-quality, commercially viable innovations.
  • Future-Ready Human Capital: Empowers a highly adaptable, top-tier workforce fully capable of navigating rapid technological shifts and sustainably driving the nation’s future development.

Date of Implementation: April 21, 2026